The effect and application of low VOC automatic cleaning process

The effect and application of low VOC automatic cleaning process

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연구 분야: Verification

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학회: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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초록

No-clean flux has been widely used in electronic products like server, handheld…etc. because the non-cleaning process has the advantages of shortening the manufacture process. Due to high reliability requirements, automotive and medical products tend to implement cleaning process to remove flux residues and reduce the risk of electrochemical migration (ECM) and corrosion. In the past, PCBA used highly volatile organic solvents such as isopropanol (IPA) to remove flux residue and contaminant, which is not friendly to labor safety and environment. In contrast, the water-based cleaning agent has the characteristics of low VOC, no flash point and environment friendly. Therefore, the industry gradually uses water-based cleaning agents to clean PCBAs instead of organic solvent. In this paper, we demonstrate the cleaning result of an automatic cleaning machine using a water-based cleaning agent for high-end electronics and inspect the flux residues inside BGA component. The experimental results show that PCB board cleaning with 100% water pressure for 600 s, it can be clearly observed that the flux has been completely removed from the QFP leads and BGA solder joints. The surface cleanliness of the cleaned PCB board is tested by Resistivity of Solvent Extraction (ROSE, IPC-TM-650 2.3.25), and it can be seen that the surface cleanliness is 0.51µg NaCl/cm2. By using water-based cleaning agents, the VOC emission has reduced significantly from the 780 g/L (IPA) to 20 g/L (water-based cleaning agents).

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