SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar PCB Integration Enabling sub-THz Microfluidic Sensor Applications

SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar PCB Integration Enabling sub-THz Microfluidic Sensor Applications

연구 분야: Software Development

학회: 2023 IEEE International 3D Systems Integration Conference (3DIC)

This paper presents a novel copper pillar based microfluidic integration within a high performance SiGe BiCMOS technology. An embedded calorimetric thermal flow sensor as key microfluidic component has been implemented based on a standard BiCMOS BEOL metallization. The integration concept has been analyzed in terms of technological development as well as it has been established via microfluidic characterization of the designed flow meter sensor. The BiCMOS microfluidic technology platform will be utilized as a sensor platform for sub-THz microfluidic sensor applications.